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Emerging Technologies 2018 Session Listing

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Session B3: Wireless and IoT Technologies

Start Time: 13:30, Thursday, May 10
Room: Sutcliffe B
Chaired by Chair to be Announced

  • 13:30 Antonio Liscidini, University of Toronto (antonio.liscidini@utoronto.ca)

    Complex poles with passive switched capacitor filters

  • 13:50 Shuhei Amakawa, Hiroshima University (amakawa@hiroshima-u.ac.jp)

    Feedback network design for transistor operating near its performance limit

    The growing demand for faster wireless communications is pushing radio frequencies in use higher up. Miniaturization of MOS transistors is still ongoing but their high-frequency performance has started to fall. Need is expected to arise to operate transistors near their performance limit. This talk will give an overview of recent progress in boosting transistor performance by circuit techniques, namely feedback. A design theory developed recently allows the designer to formulate equations for quickly finding a good initial design.

  • 14:10 Arun Natarajan, Oregon State University (nataraja@eecs.oregonstate.edu)

    Reconfigurable code/frequency/spatial filtering for full-duplex and frequency-domain duplex MIMO arrays

    The demand for higher wireless network data capacity is pushing networks towards dense spectrum reuse, wider bandwidths and towards large-element arrays. Similarly, emerging imaging applications require wide bandwidths and large arrays for high resolution. Therefore, MIMO arrays operating in interferer-rich environments from RF to mm-wave are emerging as the future design paradigm for integrated transceivers. Such large-scale arrays effectively address the challenge of closing link budgets with output power/performance available from CMOS devices. However, array scalability requires scalable RF interfaces, spatial filtering and synchronization. In this talk, I will scalable RF-path spatial/spectral/code-domain filtering architectures for in-band interferer cancellation. This approach supports MIMO operation while reducing required ADC dynamic range. I will also present related research on wideband N- path circulators, presenting a unified approach for interferer rejection. Combining the proposed architectures with baseband, analog, and digital MIMO filtering promises a path towards integrated receiver arrays for high data rate wireless communication.

  • 14:30 Rouzbeh Kananizadeh, University of California, Davis (rkanani@ucdavis.edu)

    Harmonic boosting in solid state circuits using harmonic positive feedback

    In my talk I will introduce a new concept for harmonic boosting based on linear time invariant behavior of nonlinear devices. Based on a new perspective on nonlinear electronics, I will expain how different harmonics translate to each other. By trapping the translations in a loop, second harmonic power is boosted dramatically in an oscillator, yielding high second harmonic output power and state-of-the-art phase noise performance at high millimeter wave frequencies.

  • 14:50 Aatmesh Shrivastava, Northeastern University (aatmesh@ece.neu.edu)

    Lifetime improvement of ultra-low power IoT devices

    An ultra-low power (ULP), energy-harvesting system-on-chip, that can operate in various application scenarios, is needed for enabling the trillions of Internet-of-Things (IoT) devices. However, energy from the ambient sources is little and system power consumption is high. Circuits and system development require an optimal use of available energy. In this paper, we present circuits that can improve the energy utilization in an IoT device by providing improvements at critical points of the flow of harvested energy. A boost converter circuit, that can harvest energy from 10-mV input voltage and a few nanowatt of input power, makes more harvested energy available for the IoT device. A single-inductor-multiple-output buck-boost converter provides high-efficiency and low-voltage power management solution to put most of the harvested energy for system use. A real time clock and ULP bandgap reference circuit significantly reduce the standby power consumption. The proposed ULP circuits are developed in 130-nm CMOS technology. The combined effects of these circuits and the system design technique can improve the life-time of an example IoT device by over four times in higher power consumption mode and over 70 times in ULP mode.

  • 15:10 Manos Tentzeris, Georgia Tech (etentze@ece.gatech.edu)

    3D/4D-printed smart wireless packages, energy harvesters, sensors and modules up to mmW

    In this seminar, numerous inkjet-/3D-printed flexible antennas, "smart" packages, RF electronics and sensors fabricated on a variety of substrates are introduced as a system-level solution for ultra-low-cost mass production of Millimeter-Wave Modules for Communication, Energy Harvesting and Sensing applications. Prof. Tentzeris will briefly touch up the state-of-the-art area of 3D/inkjet- printed fully-integrated wireless sensor modules on flexible or 3D multilayer substrates and demonstrate the unique capabilities of additive manufacturing for the fully 3D integration of arbitrary-shape wireless sensors with RF systems on virtually every substrate (glass, paper, plastic, ...) as well as for the first realizations of 4D (morphing/shape changing/origami) multilayer RF/microwave structures, that could potentially set the foundation for the truly convergent wireless sensor ad-hoc networks of the future with enhanced cognitive intelligence and "rugged" packaging. Prof. Tentzeris will discuss issues concerning the power sources of "near-perpetual" RF modules, including flexible energy harvesting approaches involving thermal, EM, vibration and solar energy forms. The final step of the paper will involve examples from mmW conformal/stretchable (e.g. structural health monitoring) antennas and RF modules, as well as the first examples of the integration of inkjet-printed nanotechnology-based (e.g.CNT) sensors on paper and organic substrates for IoT, smart skin and autonomous vehicle applications. Special focus will be paid on newly developed fully printed 3D ramp interconnects and IC embedding approaches as well as on-chip/on-package printed RF components for further miniaturization and enhanced package intelligence and reliability.

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